Title :
Schottky diodes in CMOS for terahertz circuits and systems
Author :
Yaming Zhang ; Ruonan Han ; Youngwan Kim ; Dae Yeon Kim ; Shichijo, H. ; Sankaran, S. ; Chuying Mao ; Eunyoung Seok ; Dongha Shim ; Kenneth, K.O.
Author_Institution :
Dept. of EE, Univ. of Texas, Dallas, TX, USA
Abstract :
Using Polysilicon Gate Separated Schottky Diode structures that can be fabricated without any process modifications in a foundry digital 130-nm CMOS process, cut-off frequency of ~2 THz has been measured. In addition, exploiting the complementary of CMOS technology, an antiparallel diode pair with cut-off frequency of ~660 GHz consisting of an n-type and a p-type Schottky diode has been demonstrated in the same 130-nm CMOS process. Using the diodes, a frequency doubler and a tripler have been demonstrated. Additionally, the diodes have been utilized to implement 280-GHz and 860-GHz detectors for imaging. A fully-integrated 280-GHz 4×4 imager array exhibits measured NEP of 29pW/Hz1/2 and responsivity of 5.1kV/W (323V/W without the amplifier). The 860-GHz detector without an amplifier achieves responsivity of 355V/W and NEP of 32pW/Hz1/2. The NEP at 860GHz is 2X better than the best reported performance of MOSFET-based imagers without a silicon lens attached to the chip.
Keywords :
CMOS integrated circuits; MOSFET; Schottky diodes; submillimetre wave circuits; terahertz wave imaging; MOSFET-based imagers; anti- parallel diode pair; detectors; digital CMOS process; frequency 2 THz; frequency 280 GHz; frequency 660 GHz; frequency 860 GHz; frequency doubler; frequency tripler; n-type Schottky diode; p-type Schottky diode; polysilicon gate separated Schottky diode structure; size 130 nm; terahertz circuits; CMOS integrated circuits; CMOS process; Detectors; Imaging; Schottky barriers; Schottky diodes; CMOS; Millimeter wave; Schottky barrier diode; Sub-millimeter wave; Terahertz; frequency multiplication; imager;
Conference_Titel :
Radio and Wireless Symposium (RWS), 2013 IEEE
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4673-2929-3
Electronic_ISBN :
2164-2958
DOI :
10.1109/RWS.2013.6486635