Title :
60 GHz AMC antennas in multi-processor multi-chip data transmission
Author :
Yeh, Ho-Hsin ; Hiramatsu, Nobuki ; Melde, Kathleen
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA
Abstract :
This paper mainly discusses the preliminary design of 60GHz antennas utilized in the multi-chip multi-core (MCMC) architecture. The antenna is designed with the low temperature co-fired ceramic (LTCC) fabrication process and the stacked via is selected as the vertical feeding. The designed antenna on the artificial magnetic conductor (AMC) demonstrates the high efficiency, impedance matching and enhanced end-fire radiation capabilities with the surface wave on the ground shielded conducting structures.
Keywords :
antennas; ceramic packaging; impedance matching; multichip modules; multiprocessing systems; AMC antennas; artificial magnetic conductor; bandwidth 60 GHz; enhanced end-fire radiation capabilities; ground shielded conducting structures; impedance matching; low temperature co-fired ceramic fabrication; multichip multicore architecture; multiprocessor multichip data transmission; stacked via; vertical feeding; Antenna radiation patterns; Conductors; Reflection; Silicon; Surface waves;
Conference_Titel :
Antenna Technology (iWAT), 2012 IEEE International Workshop on
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-4673-0036-0
DOI :
10.1109/IWAT.2012.6178639
