Microstrip discontinuities on cylindrical surfaces

Author

Huang, J. ; Vahldieck, R. ; Jin, H.

Author_Institution

Dept. of Electr. & Comput. Eng., Victoria Univ., BC., Canada

fYear

1993

Firstpage

1299

Abstract

S-parameter analysis of microstrip discontinuities on cylindrical dielectric surfaces using the full-wave frequency-domain TLM (transmission line matrix) method is presented. Microstep step and gap discontinuities on the same side of the substrate as well as overlay coupling of two microstrip lines on opposite sides of the substrate are investigated. The finite conductor thickness as well as the interaction of higher order modes between cascaded discontinuities is taken into account. The present algorithm is based on a 12-port symbolic S-matrix.<>

Keywords

S-matrix theory; S-parameters; frequency-domain analysis; microstrip lines; 12-port symbolic S-matrix; S-parameter analysis; TLM; cascaded discontinuities; cylindrical surfaces; finite conductor thickness; full-wave frequency-domain; gap discontinuities; higher order modes; microstrip discontinuities; microstrip lines; overlay coupling; transmission line matrix; Couplings; Dielectric substrates; Frequency domain analysis; Microstrip; Propagation constant; Scattering parameters; Transmission line discontinuities; Transmission line matrix methods; Transmission line theory; Waveguide discontinuities;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1993., IEEE MTT-S International

Conference_Location

Atlanta, GA, USA

ISSN

0149-645X

Print_ISBN

0-7803-1209-0

Type

conf

DOI

10.1109/MWSYM.1993.277113

Filename

277113