Title :
Microstrip discontinuities on cylindrical surfaces
Author :
Huang, J. ; Vahldieck, R. ; Jin, H.
Author_Institution :
Dept. of Electr. & Comput. Eng., Victoria Univ., BC., Canada
Abstract :
S-parameter analysis of microstrip discontinuities on cylindrical dielectric surfaces using the full-wave frequency-domain TLM (transmission line matrix) method is presented. Microstep step and gap discontinuities on the same side of the substrate as well as overlay coupling of two microstrip lines on opposite sides of the substrate are investigated. The finite conductor thickness as well as the interaction of higher order modes between cascaded discontinuities is taken into account. The present algorithm is based on a 12-port symbolic S-matrix.<>
Keywords :
S-matrix theory; S-parameters; frequency-domain analysis; microstrip lines; 12-port symbolic S-matrix; S-parameter analysis; TLM; cascaded discontinuities; cylindrical surfaces; finite conductor thickness; full-wave frequency-domain; gap discontinuities; higher order modes; microstrip discontinuities; microstrip lines; overlay coupling; transmission line matrix; Couplings; Dielectric substrates; Frequency domain analysis; Microstrip; Propagation constant; Scattering parameters; Transmission line discontinuities; Transmission line matrix methods; Transmission line theory; Waveguide discontinuities;
Conference_Titel :
Microwave Symposium Digest, 1993., IEEE MTT-S International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-1209-0
DOI :
10.1109/MWSYM.1993.277113
