DocumentCode :
1682752
Title :
System-level, thermal-aware, fully-loaded process scheduling
Author :
Li, Dong ; Chang, Hung-Ching ; Pyla, Hari K. ; Cameron, Kirk W.
Author_Institution :
Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA
fYear :
2008
Firstpage :
1
Lastpage :
7
Abstract :
Processor power consumption produces significant heat and can result in higher average operating temperatures. High operating temperatures can lead to reduced reliability and at times thermal emergencies. Previous thermal-aware techniques use dynamic voltage and frequency scaling (DVFS) or multithreaded or multicore process migration to reduce thermals. However, these methods do not gracefully handle scenarios where processors are fully loaded, i.e. there are no free threads or cores for process scheduling. We propose techniques to reduce processor temperature when processors are fully loaded. We use system-level compiler support and dynamic runtime instrumentation to identify the relative thermal intensity of processes. We implement a thermal-aware process scheduling algorithm that reduces processor thermals while maintaining application throughput. We favor "cool" processes by reducing time slice allocations for "hot" processes. Results indicate that our thermal-aware scheduling can reduce processor thermals by up to 3 degrees Celsius with little to no loss in application throughput.
Keywords :
multi-threading; power aware computing; processor scheduling; program compilers; dynamic frequency scaling; dynamic voltage scaling; multicore process migration; multithreaded process migration; process scheduling; processor power consumption; thermal-aware process scheduling algorithm; Dynamic compiler; Dynamic voltage scaling; Energy consumption; Frequency; Multicore processing; Power system reliability; Processor scheduling; Temperature; Throughput; Yarn;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Parallel and Distributed Processing, 2008. IPDPS 2008. IEEE International Symposium on
Conference_Location :
Miami, FL
ISSN :
1530-2075
Print_ISBN :
978-1-4244-1693-6
Electronic_ISBN :
1530-2075
Type :
conf
DOI :
10.1109/IPDPS.2008.4536225
Filename :
4536225
Link To Document :
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