Environmental Stress Testing with Boundary-Scan

Author

Le, Dat ; Karolik, I. ; Smith, Ronald ; Mcgovern, A.J. ; Curette, Chyral ; Ulbin, Joseph ; Zarubaiko, Michael ; Henry, Charles ; Stevens, Lewis

Author_Institution

Eng. Res. Center, AT&T Bell Labs., Princeton, NJ, USA

fYear

34608

Firstpage

307

Lastpage

313

Abstract

Environmental Stress Testing (EST) enhances product quality and reliability by detecting latent or marginal defects in a product. For EST to be effective, testing of a product must achieve a high fault coverage so that as many EST-induced defects can be detected. By utilizing Boundary-Scan (IEEE Std 1149.1-1990), EST can achieve a high fault coverage and at the same time, minimize test cost. The paper describes a complete infrastructure, both software and hardware, for using Boundary-Scan (B-S) in EST. In addition, the paper shows a simplified control mechanism to select individual circuit packs for Boundary-Scan testing. This control mechanism minimizes the number of wires required to drive the control interface and thus, the number of wires in the cable that connects a tester to the backplane of a system under test and across which Boundary-Scan tests are executed. Finally, the paper presents and discusses some study results for evaluating the effectiveness of monitored EST

Keywords

IEEE standards; automatic testing; boundary scan testing; environmental stress screening; production testing; IEEE Std 1149.1; boundary scan testing; control; control interface; effectiveness; environmental stress testing; fault coverage; latent defects; marginal defects; product quality; reliability; test cost; Circuit faults; Circuit testing; Control systems; Costs; Electrical fault detection; Fault detection; Hardware; Stress; System testing; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1994. Proceedings., International

Conference_Location

Washington, DC

ISSN

1089-3539

Print_ISBN

0-7803-2103-0

Type

conf

DOI

10.1109/TEST.1994.527964

Filename

527964