Title :
Assessment of thermo-mechanics for an integrated power electronics switching stage
Author :
Pang, Y. ; Scott, E.P. ; Zhu, N. ; van Wyk, J.D. ; Liang, Z.
Author_Institution :
Dept. of Mech. Eng., Virginia Tech, Blacksburg,VA, USA
Abstract :
With the growing demands on the performance, cost, and the advances in packaging and interconnection technology, three-dimensional (3D) packaging provides higher density packaging and reduced electrical parasitic losses. On the other hand, thermal management of the 3D package and the influence of thermomechanical effects on the module reliability become important issues. This work assesses different shape and size configurations of the contact interface between the deposited copper metallization and the silicon device in a power electronic switching stage. Considering the thermal management and thermo-mechanically developed stresses, the best interconnect pattern is presented.
Keywords :
copper; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; power integrated circuits; power semiconductor switches; silicon; thermal management (packaging); copper metallization; electrical parasitic loss; higher density packaging; integrated power electronics switching stage; interconnection technology; power module reliability; silicon device; thermal management; thermo-mechanical stress; thermo-mechanics; three-dimensional packaging; Contacts; Copper; Costs; Electronic packaging thermal management; Performance loss; Power electronics; Shape; Thermal management; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Industry Applications Conference, 2004. 39th IAS Annual Meeting. Conference Record of the 2004 IEEE
Print_ISBN :
0-7803-8486-5
DOI :
10.1109/IAS.2004.1348797
