Title :
An optimal probe testing algorithm for the connectivity verification of MCM substrates
Author :
Yao, S.-Z. ; Chou, N.-C. ; Cheng, C.-K. ; Hu, T.C.
Author_Institution :
California Univ., San Diego, La Jolla, CA, USA
Abstract :
The k-probe testing methodology is an effective approach to detect open and short faults in MCM substrates. An algorithm which generates the minimum number of tests for complete open fault coverage is proposed. For k equals two, the algorithm is able to reduce the test size by up to 50% compared with that generated by an ordinary approach. A multidimensional traveling salesman problem formulation is developed to optimize probe routes. The approach has been tested on substrate testers and has achieved excellent results.<>
Keywords :
fault location; integrated circuit testing; multichip modules; optimisation; substrates; MCM substrates; connectivity verification; multidimensional traveling salesman problem; open faults; optimal probe testing algorithm; short faults; Fault location; Integrated circuit testing; Multichip modules; Optimization methods;
Conference_Titel :
Computer-Aided Design, 1992. ICCAD-92. Digest of Technical Papers., 1992 IEEE/ACM International Conference on
Conference_Location :
Santa Clara, CA, USA
Print_ISBN :
0-8186-3010-8
DOI :
10.1109/ICCAD.1992.279363
