• DocumentCode
    1685296
  • Title

    AWE macromodels of VLSI interconnect for circuit simulation

  • Author

    Kim, S.-Y. ; Gopal, N. ; Pillage, L.T.

  • Author_Institution
    Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
  • fYear
    1992
  • Firstpage
    64
  • Lastpage
    70
  • Abstract
    The results of linear asymptotic waveform evaluation (AWE) and of nonlinear circuit simulation are combined for the purpose of efficiently incorporating accurate interconnect information in the overall circuit description. A simple macromodel based on the y-parameter description of a complex interconnect network is discussed. The model makes possible the reduction of large, stiff interconnect configurations into compact representations that pose minimal problems to conventional circuit simulation techniques. The macromodel can be incorporated directly into a conventional circuit simulation with no modification of the original simulation software. The techniques are suitable for development as a software library that can be used to enhance existing simulators so that they can handle large VLSI interconnect configurations very efficiently. In addition, the ability to handle elements at the port level makes approach extremely attractive for any linear(ized) macromodels or for application such as mixed-mode simulation.<>
  • Keywords
    VLSI; circuit analysis computing; digital simulation; distributed parameter networks; metallisation; multiport networks; packaging; poles and zeros; VLSI interconnect configurations; circuit description; compact representations; linear asymptotic waveform evaluation; macromodels; mixed-mode simulation; nonlinear circuit simulation; port level; software library; Circuit simulation; Distributed parameter circuits; Metallization; Multiport circuits; Packaging; Poles and zeros; Simulation; Very-large-scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 1992. ICCAD-92. Digest of Technical Papers., 1992 IEEE/ACM International Conference on
  • Conference_Location
    Santa Clara, CA, USA
  • Print_ISBN
    0-8186-3010-8
  • Type

    conf

  • DOI
    10.1109/ICCAD.1992.279396
  • Filename
    279396