• DocumentCode
    1686411
  • Title

    Static and dynamic energy losses vs. temperature in different CMOS technologies

  • Author

    Kocanda, Piotr ; Kos, Andrzej

  • Author_Institution
    Dept. of Electron., AGH Univ. of Sci. & Technol., Krakow, Poland
  • fYear
    2015
  • Firstpage
    446
  • Lastpage
    449
  • Abstract
    The aim of this paper is energy dissipation analysis in regards to supply voltage and temperature. The basis of all simulations are 12 different transistors coming from 6 different CMOS technologies (from 180nm to 14nm). Dynamic energy used to switch a gate from one state to the other was evaluated in a range of temperature for different supply voltages. In order to guarantee a realistic timing of control signals a special testing circuit was designed. Change of dynamic energy, as a function of temperature, regardless of supply voltage fits in range of -0.5-7.3%. Static power dissipation, a result of existing leakage currents, rises with temperature. When temperature rises from 20 to 100°C static power multiplicities at least 3 times up to 85 times. When operating with low activity static energy consumptions has higher impact on total energy consumption. In most cases one cannot ignore temperature influence on energy consumption.
  • Keywords
    CMOS integrated circuits; energy consumption; integrated circuit modelling; integrated circuit testing; leakage currents; low-power electronics; thermal analysis; transistor circuits; CMOS technologies; control signals; dynamic energy losses; energy dissipation analysis; leakage currents; size 180 nm to 14 nm; static energy consumptions; static energy losses; static power dissipation; static power multiplicities; temperature 20 degC to 100 degC; testing circuit; CMOS integrated circuits; Energy consumption; Energy loss; Inverters; Logic gates; Transistors; CMOS technology scaling; dynamic voltage scaling; static and dynamic energy losses; temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits & Systems (MIXDES), 2015 22nd International Conference
  • Conference_Location
    Torun
  • Print_ISBN
    978-8-3635-7806-0
  • Type

    conf

  • DOI
    10.1109/MIXDES.2015.7208560
  • Filename
    7208560