• DocumentCode
    1686550
  • Title

    Research and design of the millimeter wave power equalizer using waveguide on Ka-band

  • Author

    Xue Yan Wang ; Nan Yang ; Xing Qun Qi

  • Author_Institution
    Sch. of Phys. Electron., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2013
  • Firstpage
    131
  • Lastpage
    134
  • Abstract
    A power or gain equalizer is often used to smooth the gain curve when they using as the input port of Traveling Wave Tubes (TWT) or High Power Solid State Amplifiers. But the TWT had a big gain fluctuation in the working frequency. Generally, coaxial resonance cavity with electromagnetic wave absorber and micro strip resonance cavity with thin film resistance compose the equalizer. But they often used on lower millimeter such as X wave band, because they have many disadvantages in millimeter wave. One coaxial resonator will generate more than one resonating frequencies and micro strip resonance cavity has high insertion loss and low Q value. In this paper, a novel structure with H-plane full-height waveguide resonance cavity on the narrow-wall to fulfill a millimeter wave power or gain equalizer has been equalized.
  • Keywords
    cavity resonators; coaxial waveguides; equalisers; microstrip resonators; millimetre wave resonators; H-plane full-height waveguide resonance cavity; TWT; coaxial resonance cavity; coaxial resonator; electromagnetic wave absorber; gain curve; gain fluctuation; high power solid state amplifiers; micro strip resonance cavity; millimeter wave gain equalizer; millimeter wave power equalizer; narrow-wall; thin film resistance; traveling wave tubes; Cavity resonators; Couplings; Electromagnetic waveguides; Equalizers; Insertion loss; Millimeter wave technology; RLC circuits; H-plane full-height; Ka band; gain equalizer; resonance cavity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-0068-8
  • Type

    conf

  • DOI
    10.1109/ASEMD.2013.6780725
  • Filename
    6780725