DocumentCode :
1687019
Title :
Study of fault-tolerant routing algorithm of NoC based on 2D-Mesh topology
Author :
Shu Yan Jiang ; Yue Liu ; Jiang Bo Luo ; He Cheng ; Gang Luo
Author_Institution :
Sch. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear :
2013
Firstpage :
189
Lastpage :
193
Abstract :
Since various software errors or hardware failures may destroy the transfer data of Network-on-Chip (NoC), it is essential to study the fault-tolerant methods of NoC. Based on the original XY Dimension Order Routing algorithm, this paper improved the single link failure tolerance, by reconfiguration and defining a new deterministic routing algorithm for all routers on a cycle-free contour around a faulty link to replace the broken paths with new unique paths. Then we gave the follow-up improvement ideology for link failures and router fault tolerance. Finally, it proved that the design of the routing algorithm can successfully avoid all six kinds of single link failures, and the fault-tolerant algorithm was verified on the ISE platform to proved to be reliable and effective. Thanks to the algorithm does not require virtual channels, the area and power consumption will be reduced.
Keywords :
failure analysis; fault tolerance; integrated circuit reliability; network routing; network topology; network-on-chip; 2D mesh topology; ISE platform; NoC; NoC transfer data; deterministic routing algorithm; fault-tolerant method; fault-tolerant routing algorithm; follow-up improvement ideology; hardware failures; network-on-chip transfer data; original XY dimension order routing algorithm; router fault tolerance; single-link failure tolerance; software errors; virtual channels; Algorithm design and analysis; Fault tolerance; Fault tolerant systems; Routing; Software algorithms; System recovery; System-on-chip; ISE; XY routing algorithm; fault tolerant; network on-chip; router;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-0068-8
Type :
conf
DOI :
10.1109/ASEMD.2013.6780741
Filename :
6780741
Link To Document :
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