Title :
A method to measure impedance of chip/package/board power supply system using pseudo-impulse current
Author :
Zhou, Yaping ; Dhong, Sang H. ; Flachs, Brian ; Harvey, Paul M. ; Michael, Brad W.
Author_Institution :
IBM Corp., Austin, TX
Abstract :
A method to measure the impedance Z(f) of a chip/package/board power supply system using pseudo-impulse current is described. This method can be easily applied to the digital systems with synchronous clocking systems. A PowerPC based microprocessor power supply system is used as an example to show the effectiveness of the method
Keywords :
electric impedance measurement; microprocessor chips; power supply circuits; digital systems; impedance measurement; microprocessor power supply system; pseudo-impulse current; synchronous clocking systems; Circuits; Clocks; Current measurement; Frequency; Impedance measurement; Microprocessors; Packaging; Power measurement; Power supplies; Semiconductor device measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321183
