Efficient Modeling of Package Power Delivery Networks with Fringing Fields and Gap Coupling in Mixed Signal Systems

Author

Bharath, Krishna ; Engin, Ege ; Swaminathan, Madhavan ; Uriu, Kazuhide ; Yamada, Toru

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA

fYear

2006

Firstpage

59

Lastpage

62

Abstract

Full-wave EM simulations are computationally expensive given the complexity of packaging structures in modern mixed signal systems. Fast methods such as the transmission matrix method are inaccurate as they do not model discontinuities such as metal edges and gaps. In this paper, simple models for the edge effect and gap coupling are developed for the finite difference frequency domain method. Results are presented comparing the accuracy of the proposed method with full-wave simulations and measurements

Keywords

coupled circuits; distribution networks; electronics packaging; finite difference methods; mixed analogue-digital integrated circuits; edge effect coupling; finite difference frequency domain; fringing fields; full wave EM simulations; gap coupling; mixed signal systems; package power delivery networks; Circuit simulation; Coupling circuits; Design engineering; Electronics packaging; Equivalent circuits; Finite difference methods; Frequency domain analysis; Microstrip; Power system modeling; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2006 IEEE

Conference_Location

Scottsdale, AZ

Print_ISBN

1-4244-0668-4

Type

conf

DOI

10.1109/EPEP.2006.321190

Filename

4115350