DocumentCode :
1688060
Title :
Session VI Open Forum/Posters Modeling and Simulation
fYear :
2006
Firstpage :
77
Lastpage :
77
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ, USA
Print_ISBN :
1-4244-0668-4
Type :
conf
DOI :
10.1109/EPEP.2006.321195
Filename :
4115355
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1688060
