Title :
On the Effect of Mobile Device Shape Characteristics to Interconnection Noise Coupling to an RF Chip Antenna
Author :
Hynynen, Lauri ; Tarvainen, Timo ; Rouvala, Markku ; Renko, Antti
Author_Institution :
Esju Oy, Oulu
Abstract :
Digital interconnections in mobile devices can cause radiative coupling to RF antennas and devices. This paper discusses measurements and modeling of coupling from a digital interconnection to an RF chip antenna with various positional and device shape characteristics
Keywords :
integrated circuit interconnections; integrated circuit noise; microwave antennas; coupling measurements; coupling modeling; digital interconnections; interconnection noise coupling; mobile device; radiative coupling; radiofrequency chip antenna; shape characteristics; Antenna measurements; Crosstalk; Integrated circuit interconnections; Mobile antennas; Noise measurement; Noise shaping; Position measurement; Radio frequency; Scattering parameters; Shape;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321208
