DocumentCode :
1688519
Title :
On-Chip Interconnect
fYear :
2006
Firstpage :
135
Lastpage :
135
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ, USA
Print_ISBN :
1-4244-0668-4
Type :
conf
DOI :
10.1109/EPEP.2006.321210
Filename :
4115370
Link To Document :
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