DocumentCode :
1688659
Title :
Investigation of AC losses for HTS coils with parallel wound copper tapes
Author :
Zhi Fu Chen ; Jing Yin Zhang ; Zi Qiang Wei ; Li Zhong Wang ; Ying Xin ; Wei Zhi Gong ; Hui Hong
Author_Institution :
Sch. of Mech. Eng., Tianjin Univ., Tianjin, China
fYear :
2013
Firstpage :
391
Lastpage :
394
Abstract :
In some applications, copper wires or tapes are used in parallel with HTS tapes for fabricating magnet coil to enhance its mechanical and electrical stability. The addition of the copper tapes might increase AC loss of the coil. In this work, we investigated the AC loss of HTS coils with strengthening copper tapes. Two HTS coils are fabricated. One is made of HTS tapes only; the other is made of HTS tapes and parallel copper tapes. The HTS tape is G1 Bi-2223/Ag tape with 4.6 mm width and 0.22 mm thickness. The width and thickness of copper tape are 5 mm and 0.1 mm respectively. The inner and outer diameters of the coils are 70 mm and 90mm respectively, with a height is 45 mm. AC loss of the coils was measured by weighting the liquid nitrogen evaporating rate under different AC loads. The experimental data show that the copper tape does not substantially increase the AC loss of the coils.
Keywords :
copper; dielectric losses; high-temperature superconductors; mechanical stability; superconducting coils; wires (electric); AC loads; AC losses; Cu; G1 Bi-2223/Ag tape; HTS coils; HTS tapes; electrical stability; liquid nitrogen evaporating rate; magnet coil; mechanical stability; parallel wound tapes; size 0.1 mm; size 0.22 mm; size 4.6 mm; size 45 mm; size 5 mm; size 70 mm; size 90 mm; Coils; Copper; Current measurement; Heating; High-temperature superconductors; Loss measurement; Temperature measurement; AC losses; HTS coil; high temparature superconductor; strengthening copper tape;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-0068-8
Type :
conf
DOI :
10.1109/ASEMD.2013.6780802
Filename :
6780802
Link To Document :
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