Title :
OpticTM the new generation of microoptical subassemblies
Author :
Weigert, M. ; Bittner, Matthias
Author_Institution :
Dept. of Fiber Opt. Eng., Infineon Technol., Regensburg
fDate :
6/21/1905 12:00:00 AM
Abstract :
Past experiences in “back-end-technology” has shown that a plastic package is the key to cost reduction which gives the customer advantages. Most of optical subassemblies are packaged in TO-cans because of they are hermetically leak proof, gives light guidance in air, and because of the higher expansions coefficient of plastics etc. The development of a new submount technology, as well as known plastic packaging techniques and experience in fiber coupling, offers the possibility of combination the existing know how in one company. The production of integrated submounts, batch assembly, leadframe, mold techniques and optical coupling will be described in the following paper. Furthermore, first results will be shown and give an overview of the possibilities which are offered by the new package
Keywords :
plastic packaging; TO-cans; back-end-technology; batch assembly; cost reduction; customer advantages; fiber coupling; hermetically leak proof; integrated submounts; leadframe techniques; microoptical subassemblies; mold techniques; optical coupling; optical subassemblies; overview; plastic package; plastic packaging technique; submount technology;
Conference_Titel :
Microengineering in Optics and Optoelectronics (Ref. No. 1999/187), IEE Colloquium on
Conference_Location :
London
DOI :
10.1049/ic:19990866