Title :
Distortion Minimization for Packaging Level Interconnects
Author :
Zhu, Haikun ; Shi, Rui ; Chen, Hongyu ; Cheng, Chung-Kuan ; Deutsch, Alina ; Katopis, George
Author_Institution :
Dept. of Comput. Sci. & Eng., Univ. of California San Diego, La Jolla, CA
Abstract :
We propose a novel high-speed serial signaling scheme that minimizes the distortion for multichip module (MCM) packaging level communication by intentionally adding leakage resistors between the signal trace and the ground. The new scheme is inspired by the theory of distortionless transmission line which states that if R/G = L/C, there will be no distortion at the receiver end and the signal propagates at the speed of light. The simulation results indicate that, using the shunt resistor scheme, 10+ Gbps bit rate is achievable over a 10 cm single-ended stripline without pre-emphasis or equalization
Keywords :
distortion; high-speed integrated circuits; integrated circuit packaging; minimisation; multichip modules; resistors; 10 cm; distortion minimization; distortionless transmission line; high speed serial signaling scheme; leakage resistors; multichip module; packaging level interconnects; receiver end; shunt resistor; signal trace; single ended stripline; Attenuation; Drives; Electronics packaging; Frequency; Phase distortion; Power transmission lines; Resistors; Skin effect; Stripline; Transmission line theory;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321221
