Distortion Minimization for Packaging Level Interconnects

Author

Zhu, Haikun ; Shi, Rui ; Chen, Hongyu ; Cheng, Chung-Kuan ; Deutsch, Alina ; Katopis, George

Author_Institution

Dept. of Comput. Sci. & Eng., Univ. of California San Diego, La Jolla, CA

fYear

2006

Firstpage

175

Lastpage

178

Abstract

We propose a novel high-speed serial signaling scheme that minimizes the distortion for multichip module (MCM) packaging level communication by intentionally adding leakage resistors between the signal trace and the ground. The new scheme is inspired by the theory of distortionless transmission line which states that if R/G = L/C, there will be no distortion at the receiver end and the signal propagates at the speed of light. The simulation results indicate that, using the shunt resistor scheme, 10+ Gbps bit rate is achievable over a 10 cm single-ended stripline without pre-emphasis or equalization

Keywords

distortion; high-speed integrated circuits; integrated circuit packaging; minimisation; multichip modules; resistors; 10 cm; distortion minimization; distortionless transmission line; high speed serial signaling scheme; leakage resistors; multichip module; packaging level interconnects; receiver end; shunt resistor; signal trace; single ended stripline; Attenuation; Drives; Electronics packaging; Frequency; Phase distortion; Power transmission lines; Resistors; Skin effect; Stripline; Transmission line theory;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2006 IEEE

Conference_Location

Scottsdale, AZ

Print_ISBN

1-4244-0668-4

Type

conf

DOI

10.1109/EPEP.2006.321221

Filename

4115381