Title :
Delay-Based Macromodels for Long Interconnects via Time-Frequency Decompositions
Author :
Talocia, S. Grivet
Author_Institution :
Dip. Elettronica, Politecnico di Torino
Abstract :
We introduce a new macromodeling scheme for electrically long interconnects characterized by tabulated frequency responses. The transfer function of the interconnect is modeled as a superposition of multiple single-delay atoms, which are identified via a selective inversion of a Gabor transform of the raw frequency data. Each atom is then approximated by a delayed rational function, leading to a highly-efficient SPICE-ready macromodel
Keywords :
SPICE; integrated circuit interconnections; integrated circuit modelling; transfer functions; Gabor transform; SPICE; delay based macromodels; long interconnects; macromodeling scheme; multiple single delay atoms; selective inversion; tabulated frequency responses; time frequency decompositions; transfer function; Atomic measurements; Electromagnetic scattering; Electronics packaging; Frequency measurement; Propagation delay; Time domain analysis; Time frequency analysis; Transfer functions; Transmission line matrix methods; Transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321228