DocumentCode
1689134
Title
The research of thickness measurement to thin materials by ultrasonic amplitude spectra
Author
Qin Lei Sun ; Ai Hua Li ; Mei Quan Liu ; Xiao Gang Han
Author_Institution
Shijiazhuang Mech. Eng. Coll., Shijiazhuang, China
fYear
2013
Firstpage
462
Lastpage
464
Abstract
It´s difficult to distinguish the echo superimposed signal between Thin layer interface up and down when measuring thickness by ultrasonic method. In order to solve this problem, ultrasonic signal processing methods is used to extract characterization of thickness, and the high-precision thickness of thin layer material is realized. This method overcomes the defects that can´t separate superposition using traditional echo method.
Keywords
acoustic signal processing; echo; thickness measurement; ultrasonic materials testing; ultrasonic measurement; echo superimposed signal; thickness measurement; thin layer interface; thin layer material; ultrasonic amplitude spectra; ultrasonic signal processing method; Biomedical measurement; Materials; Surface acoustic waves; Surface impedance; Thickness measurement; Ultrasonic variables measurement; thickness measurement; thin materials; ultrasonic amplitude spectra;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4799-0068-8
Type
conf
DOI
10.1109/ASEMD.2013.6780820
Filename
6780820
Link To Document