• DocumentCode
    1689134
  • Title

    The research of thickness measurement to thin materials by ultrasonic amplitude spectra

  • Author

    Qin Lei Sun ; Ai Hua Li ; Mei Quan Liu ; Xiao Gang Han

  • Author_Institution
    Shijiazhuang Mech. Eng. Coll., Shijiazhuang, China
  • fYear
    2013
  • Firstpage
    462
  • Lastpage
    464
  • Abstract
    It´s difficult to distinguish the echo superimposed signal between Thin layer interface up and down when measuring thickness by ultrasonic method. In order to solve this problem, ultrasonic signal processing methods is used to extract characterization of thickness, and the high-precision thickness of thin layer material is realized. This method overcomes the defects that can´t separate superposition using traditional echo method.
  • Keywords
    acoustic signal processing; echo; thickness measurement; ultrasonic materials testing; ultrasonic measurement; echo superimposed signal; thickness measurement; thin layer interface; thin layer material; ultrasonic amplitude spectra; ultrasonic signal processing method; Biomedical measurement; Materials; Surface acoustic waves; Surface impedance; Thickness measurement; Ultrasonic variables measurement; thickness measurement; thin materials; ultrasonic amplitude spectra;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-0068-8
  • Type

    conf

  • DOI
    10.1109/ASEMD.2013.6780820
  • Filename
    6780820