DocumentCode :
1689226
Title :
AC dielectric strength of polymer materials under tensile stress at 77K and normal temperature
Author :
Meng Song ; Kun Nan Cao ; Da Da Wang ; Xin Yang ; Bin Wei
Author_Institution :
Yunnan Power Grid Corp., Kunming, China
fYear :
2013
Firstpage :
476
Lastpage :
477
Abstract :
The performance of dielectric materials has an important effect on influencing the service life of the electric equipments. The dielectric sheets used for superconducting devices usually endure several lapping tension when lapped on the conductor, so the AC dielectric strengths of polymer sheets under tensile status are important to dielectric design. In this paper, a special electrode system was designed to measure the breakdown voltages of polyimide and poly tetra fluoro ethylene (PTFE) sheets under tensile status both in air at normal temperature and in liquid nitrogen at 77 K. The test data are processed by the method of Weibull plot. As a result, the AC breakdown strengths of polyimide films in liquid nitrogen at 77 K increase significantly as the tensile stresses increasing, the most amplitude achieves 29.16%. The breakdown strengths of polyimide under tensile stress are significantly higher than PTFE in liquid nitrogen at 77 K, the most increasing amplitude achieves 121.43%. Polyimide has good dielectric characteristics under tensile status in liquid nitrogen at 77 K.
Keywords :
dielectric materials; electric breakdown; materials testing; polymers; tensile strength; AC breakdown strengths; AC dielectric strengths; Weibull plot; dielectric design; dielectric materials; dielectric sheets; electric equipments; electrode system; liquid nitrogen; poly tetra fluoro ethylene sheets; polyimide films; polymer materials; polymer sheets; superconducting devices; temperature 77 K; tensile status; tensile stress; Dielectrics; Electric breakdown; Liquids; Nitrogen; Polyimides; Tensile stress; breakdown strength; liquid nitrogen environment; tensile status; weibull plot;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-0068-8
Type :
conf
DOI :
10.1109/ASEMD.2013.6780824
Filename :
6780824
Link To Document :
بازگشت