Title :
A test methodology to support an ASEM MCM foundry
Author :
Storey, T. ; Lapihuska, C. ; Atwood, E. ; Su, L.
Author_Institution :
Loral Federal Syst., Manassas, VA, USA
Abstract :
MCM testing can be challenging enough when the chip, substrate, and MCM design are within the control of the same company. In the foundry environment, however, even more robust strategies must be adopted. In this paper a test methodology is described which consolidates the various MCM test stages to form a flexible, low-cost, quick turn-around-time test flow
Keywords :
application specific integrated circuits; automatic testing; integrated circuit interconnections; integrated circuit testing; multichip modules; substrates; ARPA; ASEM MCM foundry; Application Specific Electronic Modules; MCM testing; chip internal test; die test; distributed testing; flexible low-cost testing; functional test; interconnect test; multichip module; robust strategies; standards; substrate test; test methodology; Costs; Fault detection; Foundries; Life testing; Manufacturing; Microelectronics; Military standards; Packaging; Production facilities; System testing;
Conference_Titel :
Test Conference, 1994. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2103-0
DOI :
10.1109/TEST.1994.527984
