• DocumentCode
    1689319
  • Title

    Investigation of orthogonal experiment for fabrication of soldering joint for a 4 T HTS coil

  • Author

    Feng Zhou ; Jun Sheng Cheng ; Ying Xu ; Shou Sen Song ; Yin Ming Dai ; Qiu Liang Wang

  • Author_Institution
    Key Lab. of Appl. Supercond., Inst. of Electr. Eng., Beijing, China
  • fYear
    2013
  • Firstpage
    492
  • Lastpage
    493
  • Abstract
    Joining process of individual BSCCO conductors is inevitable; because the double pancake coils need to be connected with each other. Since the resistance characteristics of joint can affect the stability of NMR system seriously, we did a research on soldering joint in this work. As resistance characteristics of soldering joint can vary with conditions such as joint length, thickness, temperature and so on, we conducted short sample joint experiments with orthogonal experimental design. The significance of each condition´s influence was calculated quantitatively, andan appropriate soldering condition was put forward, under which the lowest joint resistance can be obtained. We also applied this appropriate soldering condition to fabricate joints for a 4 T HTS coil and tested its practical electrical properties.
  • Keywords
    bismuth compounds; calcium compounds; high-temperature superconductors; soldering; solders; strontium compounds; superconducting coils; BSCCO conductors; Bi2Sr2CaCu2Ox; HTS coil; NMR system stability; double pancake coils; joining process; joint length; joint resistance; orthogonal experiment; resistance characteristics; soldering joint; thickness; Bismuth compounds; Coils; High-temperature superconductors; Joints; Resistance; Soldering; BSCCO; HTS coil; electrical properties; orthogonal experiment; soldering joint;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-0068-8
  • Type

    conf

  • DOI
    10.1109/ASEMD.2013.6780828
  • Filename
    6780828