DocumentCode
1689319
Title
Investigation of orthogonal experiment for fabrication of soldering joint for a 4 T HTS coil
Author
Feng Zhou ; Jun Sheng Cheng ; Ying Xu ; Shou Sen Song ; Yin Ming Dai ; Qiu Liang Wang
Author_Institution
Key Lab. of Appl. Supercond., Inst. of Electr. Eng., Beijing, China
fYear
2013
Firstpage
492
Lastpage
493
Abstract
Joining process of individual BSCCO conductors is inevitable; because the double pancake coils need to be connected with each other. Since the resistance characteristics of joint can affect the stability of NMR system seriously, we did a research on soldering joint in this work. As resistance characteristics of soldering joint can vary with conditions such as joint length, thickness, temperature and so on, we conducted short sample joint experiments with orthogonal experimental design. The significance of each condition´s influence was calculated quantitatively, andan appropriate soldering condition was put forward, under which the lowest joint resistance can be obtained. We also applied this appropriate soldering condition to fabricate joints for a 4 T HTS coil and tested its practical electrical properties.
Keywords
bismuth compounds; calcium compounds; high-temperature superconductors; soldering; solders; strontium compounds; superconducting coils; BSCCO conductors; Bi2Sr2CaCu2Ox; HTS coil; NMR system stability; double pancake coils; joining process; joint length; joint resistance; orthogonal experiment; resistance characteristics; soldering joint; thickness; Bismuth compounds; Coils; High-temperature superconductors; Joints; Resistance; Soldering; BSCCO; HTS coil; electrical properties; orthogonal experiment; soldering joint;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4799-0068-8
Type
conf
DOI
10.1109/ASEMD.2013.6780828
Filename
6780828
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