• DocumentCode
    1689452
  • Title

    A Wide-VDD Embedded SRAM for Dynamic Voltage Asynchronous Systems

  • Author

    Yang, Shu-Meng ; Chang, Meng-Fan ; Chen, Kung-Ting ; Wu, Wen-Chin ; Chu, Yuan-Hua ; Chao, Ting-Sheng ; Chen, Ming-Bin ; Chen, Ping-cheng

  • Author_Institution
    Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2009
  • Firstpage
    20
  • Lastpage
    24
  • Abstract
    Voltage-dependent timing skews in precharge and sensing activities cause functional failure and reduce the speed of asynchronous SRAM. Data-dependent bitline leakage current further increases the timing skews and reduces the yield of asynchronous SRAM. A dual-mode self-timed (DMST) technique is developed for asynchronous SRAM to eliminate the timing-skew-induced failures and speed overhead across various process, voltage and temperature (PVT) conditions. Measurements demonstrated that the DMST technique can be operated continuously over a wide range of supply voltages, from 39.4% to 151.5% (or 212.1%, given device durability) of the nominal supply voltage (3.3 V). The fabricated macros also confirmed that the DMST technique is scalable for various bitline lengths, and offers the same area overhead as conventional sense-tracking-only replica-column schemes.
  • Keywords
    SRAM chips; asynchronous circuits; embedded systems; failure analysis; integrated circuit reliability; DMST technique; data-dependent bitline leakage current; dual-mode self-timed technique; dynamic voltage asynchronous system; functional failure; voltage 3.3 V; voltage-dependent timing skew; wide-VDD embedded SRAM; Chaotic communication; Circuits; Conferences; Decoding; Degradation; Random access memory; System testing; System-on-a-chip; Timing; Voltage control; Timing skew; asynchronous SRAM; bitline leakage; destructive read;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Technology, Design, and Testing, 2009. MTDT '09. IEEE International Workshop on
  • Conference_Location
    Hsinchu
  • Print_ISBN
    978-0-7695-3797-9
  • Type

    conf

  • DOI
    10.1109/MTDT.2009.14
  • Filename
    5279847