Title :
Design of Wideband Impedance Matching for Through-Hole Via Transition Using Ellipse-Shaped Anti-Pad
Author :
Wei-Da Guo ; Chine, Wei Ning ; Wang, Chien Lin ; Shiue, Guang Hwa ; Wu, Ruey Beei
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei
Abstract :
A systematic design procedure is derived to improve the electrical performance of multilayer through-hole via transition using high-impedance interconnects. In addition to thinner transmission line, a novel structure with ellipse-shaped anti-pad is proposed to achieve the better broadband matching condition. The compensation method also applies to a differential via transition successfully
Keywords :
impedance matching; integrated circuit design; integrated circuit interconnections; transmission lines; broadband matching condition; differential via transition; electrical performance; ellipse-shaped anti-pad; high-impedance interconnects; multilayer through-hole via transition; transmission line; wideband impedance matching; Circuit simulation; Design engineering; Distributed parameter circuits; Electronics packaging; Equivalent circuits; Impedance matching; Integrated circuit interconnections; Nonhomogeneous media; Transmission line theory; Wideband;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321240
