Title :
Common Mode Return Loss Consideration in Wirebond Packaging for High Speed SerDes Links
Author :
Nanju Na ; Arseneault, Marcel ; Yonehara, Katsuyuki ; Hu, Haitian ; Zwitter, Deborah ; Wolf, Edward M. ; Srinivasan, Krishna ; Cox, Carrie ; Anderson, Richard
Abstract :
This paper discusses the trade-offs in performance and cost of high speed SerDes in wirebond package applications. While many protocol standards specify requirements for both common mode return loss and differential mode return loss, meeting both sets of requirements in low cost wirebond packages requires the designer to make significant trade-offs. The performance and cost impacts of improving common mode return loss in wirebond packaging is examined from several different points of view
Keywords :
integrated circuit bonding; integrated circuit packaging; lead bonding; common mode return loss; differential mode return loss; high speed SerDes links; protocol standards; wirebond packaging; Costs; Electromagnetic interference; Impedance; Integrated circuit interconnections; Noise generators; Packaging; Performance loss; Reflection; Signal design; Stripline;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321243
