Title :
Experimental Evaluation of High-speed Data Transmission in a Waveguide-based Interconnect
Author :
Suntives, Asanee ; Abhari, Ramesh
Author_Institution :
Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que.
Abstract :
The waveguide-based interconnects can be embedded within the substrate of electronic systems using PCB technology. In this paper, the first experimental validation of a waveguide-based interconnect system for high-speed digital transmission is presented. The efficiency of the interconnect is demonstrated by measuring the eye diagrams for 2.5Gb/s data transmission
Keywords :
integrated circuit interconnections; printed circuit design; 2.5 Gbit/s; PCB technology; electronic systems; high-speed data transmission; high-speed digital transmission; waveguide-based interconnect; Conducting materials; Data communication; Dielectric substrates; Electromagnetic waveguides; Integrated circuit interconnections; Metamaterials; Microstrip; Periodic structures; Planar waveguides; Waveguide transitions;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321152
