Title :
High-Speed Flex Chip-to-Chip Interconnect
Author :
Braunisch, Henning ; Jaussi, James E. ; Mix, Jason A.
Author_Institution :
Intel Corp., Chandler, AZ
Abstract :
Signaling rates up to 20 Gb/s on a flex-circuit chip-to-chip interconnect are reported in active testing based on 90-nm CMOS circuits. The characterization of two flex connector prototypes demonstrates their basic durability and good high-frequency performance
Keywords :
CMOS integrated circuits; flexible electronics; high-speed integrated circuits; integrated circuit interconnections; integrated circuit testing; 90 nm; CMOS circuits; active testing; flex connector; high-speed flex chip-to-chip interconnect; signaling rates; Backplanes; CMOS technology; Circuit testing; Connectors; Packaging; Prototypes; Sockets; Substrates; TV; USA Councils;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321153
