DocumentCode :
1689746
Title :
Study of PCB Trace Crosstalk in Backplane Connector Pin Field
Author :
Chia, Ben ; Kollipara, Ravi ; Oh, Dan ; Yuan, Chuck ; Boluna, Luis S.
Author_Institution :
Rambus Inc., Los Altos, CA
fYear :
2006
Firstpage :
281
Lastpage :
284
Abstract :
PCB traces in backplane are typically routed as striplines, which create near end crosstalk, but theoretically, no far end crosstalk. However, in practice, both near end and far end crosstalk introduced by via antipads and layer misalignment in the connector pin field due to manufacturing process variations can be significant. This paper presents an analysis for the first time of the PCB trace crosstalk in the connector pin field of high speed backplanes. Crosstalk from the adjacent differential pairs on the same layer and in particular, from neighboring layers is first modeled and simulated with the consideration of PCB design tolerances and routing constraints in the connector pin field. The model is then correlated with a 10ps edge TDR measurement. Finally, the simulated and measured results are provided to demonstrate the significance of the crosstalk due to connector pin field traces
Keywords :
crosstalk; printed circuits; PCB trace crosstalk; backplane connector pin field; high speed backplane; Backplanes; Connectors; Crosstalk; Electronics packaging; Impedance; Loss measurement; Manufacturing processes; Pins; Routing; Stripline;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
Type :
conf
DOI :
10.1109/EPEP.2006.321155
Filename :
4115409
Link To Document :
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