DocumentCode
1689746
Title
Study of PCB Trace Crosstalk in Backplane Connector Pin Field
Author
Chia, Ben ; Kollipara, Ravi ; Oh, Dan ; Yuan, Chuck ; Boluna, Luis S.
Author_Institution
Rambus Inc., Los Altos, CA
fYear
2006
Firstpage
281
Lastpage
284
Abstract
PCB traces in backplane are typically routed as striplines, which create near end crosstalk, but theoretically, no far end crosstalk. However, in practice, both near end and far end crosstalk introduced by via antipads and layer misalignment in the connector pin field due to manufacturing process variations can be significant. This paper presents an analysis for the first time of the PCB trace crosstalk in the connector pin field of high speed backplanes. Crosstalk from the adjacent differential pairs on the same layer and in particular, from neighboring layers is first modeled and simulated with the consideration of PCB design tolerances and routing constraints in the connector pin field. The model is then correlated with a 10ps edge TDR measurement. Finally, the simulated and measured results are provided to demonstrate the significance of the crosstalk due to connector pin field traces
Keywords
crosstalk; printed circuits; PCB trace crosstalk; backplane connector pin field; high speed backplane; Backplanes; Connectors; Crosstalk; Electronics packaging; Impedance; Loss measurement; Manufacturing processes; Pins; Routing; Stripline;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321155
Filename
4115409
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