DocumentCode :
1689831
Title :
A Framework And Simulator for Parallel Fast Integral Equation Simulation of Microelectronic Structures
Author :
Jandhyala, Vikram ; Yang, Chuanyi ; Chakraborty, Shiladri ; Chowdhury, Ranil ; Pingenot, James ; Williams, Doug
Author_Institution :
Adv. Comput. Eng. Lab, Washington Univ.
fYear :
2006
Firstpage :
287
Lastpage :
290
Abstract :
As a part of IBM´s special session, this paper presents a framework and integral equation-based 3D electromagnetic simulator for parallel simulation of microelectronic structures including those of interest to IBM. The translators, mesher, and simulator is described and is validated for initial cases. Progress on the IBM benchmark is reported
Keywords :
circuit simulation; computational electromagnetics; integral equations; integral equation-based 3D electromagnetic simulator; microelectronic structures; parallel fast integral equation simulation; Circuit simulation; Computational modeling; Concurrent computing; Data structures; Electronics packaging; Green´s function methods; Integral equations; Iterative algorithms; Matrix decomposition; Microelectronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
Type :
conf
DOI :
10.1109/EPEP.2006.321157
Filename :
4115411
Link To Document :
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