Title :
Large Scale Simulation of an Integrated Circuit Package
Author :
Gjonaj, E. ; Perotoni, M. ; Weiland, T.
Author_Institution :
Inst. fur Theoric Elektromagnetischer Felder, Technische Univ. Darmstadt
Abstract :
A full-wave parallel simulation of a complete IC package is performed. The simulation is based on a specialized domain decomposition method which allows for highly balanced parallel computations. Preliminary results including signal wave forms and delay times are given
Keywords :
circuit simulation; integrated circuit packaging; full-wave parallel simulation; integrated circuit package; large scale simulation; Circuit simulation; Computational modeling; Distributed computing; Electronics packaging; Frequency; Geometry; Integrated circuit modeling; Integrated circuit packaging; Large scale integration; Solid modeling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321158
