Large Scale Signal and Interconnect FDTD Modeling for BGA Package

Author

Chen, Xiaohe ; Drewniak, James L. ; Zhang, Jianmin ; Cracraft, Michael ; Archambeault, Bruce ; Connor, Samuel

Author_Institution

Dept of Electr. & Comput. Eng., Missouri Univ., Rolla, MO

fYear

2006

Firstpage

299

Lastpage

302

Abstract

This paper introduces a finite-difference time-domain (FDTD) approach to modeling portions of ball grid array (BGA) package interconnect circuits. A full wave circuit model including vias, trace segments, and ground vias was generated, using a computer gridding tool, and fed into the FDTD (Taflove and Hagness, 2005) program. The simulated results were correlated with TDR measurements

Keywords

ball grid arrays; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit modelling; BGA package; ball grid array package interconnect circuits; computer gridding tool; finite-difference time-domain approach; full wave circuit model; large scale interconnect FDTD modeling; large scale signal FDTD modeling; Circuit simulation; Data mining; Dielectrics; Electronics packaging; Finite difference methods; Integrated circuit interconnections; Large-scale systems; Mesh generation; Solid modeling; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2006 IEEE

Conference_Location

Scottsdale, AZ

Print_ISBN

1-4244-0668-4

Type

conf

DOI

10.1109/EPEP.2006.321160

Filename

4115414

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1689884