DocumentCode
1690049
Title
Principles for Physical-Based Gridding of Package Structures
Author
Rubin, B.
Author_Institution
IBM Res. Div., TJ Watson Res. Center, Yorklown Heights, NY
fYear
2006
Firstpage
321
Lastpage
324
Abstract
We describe a number of rules for gridding packaging structures for subsequent electromagnetic analysis. The rules are based upon conductor proximity and other physical effects. Difficulties in developing the associated gridding algorithms are discussed and examples are presented
Keywords
electromagnetism; electronics packaging; conductor proximity; electromagnetic analysis; package structures; physical-based gridding; Conductors; Current distribution; Electronics packaging; Image analysis; Peak to average power ratio; Performance analysis; Physics; Programmable logic arrays; Signal analysis; TV;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321166
Filename
4115420
Link To Document