Title :
Principles for Physical-Based Gridding of Package Structures
Author_Institution :
IBM Res. Div., TJ Watson Res. Center, Yorklown Heights, NY
Abstract :
We describe a number of rules for gridding packaging structures for subsequent electromagnetic analysis. The rules are based upon conductor proximity and other physical effects. Difficulties in developing the associated gridding algorithms are discussed and examples are presented
Keywords :
electromagnetism; electronics packaging; conductor proximity; electromagnetic analysis; package structures; physical-based gridding; Conductors; Current distribution; Electronics packaging; Image analysis; Peak to average power ratio; Performance analysis; Physics; Programmable logic arrays; Signal analysis; TV;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321166
