• DocumentCode
    1690110
  • Title

    Full-Circuit Design Optimization of a RF Silicon Integrated Passive Device

  • Author

    Liu, Kai ; Frye, Robert C.

  • Author_Institution
    STATS ChipPAC, Tempe, AZ
  • fYear
    2006
  • Firstpage
    327
  • Lastpage
    330
  • Abstract
    A schematic-electromagnetic (EM) hybrid optimization scheme was used to design an integrated passive device (IPD)-diplexer. The method uses component values derived from circuit simulation and optimization to determine physical design changes. The diplexer was fabricated in a silicon wafer process. The small form-factor (2.6 times 1.3 times 0.25 mm3) of this device makes it very attractive for system in package (SiP) applications. Simulated and measured results show good agreement
  • Keywords
    circuit optimisation; monolithic integrated circuits; radiofrequency integrated circuits; system-in-package; RF silicon integrated passive device; full-circuit design optimization; integrated passive device diplexer; schematic-electromagnetic hybrid optimization scheme; silicon wafer process; system in package; Circuit optimization; Circuit simulation; Circuit synthesis; Coupling circuits; Design optimization; Electronics packaging; Filters; Radio frequency; Semiconductor device packaging; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2006 IEEE
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    1-4244-0668-4
  • Type

    conf

  • DOI
    10.1109/EPEP.2006.321244
  • Filename
    4115422
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1690110