Title :
Full-Circuit Design Optimization of a RF Silicon Integrated Passive Device
Author :
Liu, Kai ; Frye, Robert C.
Author_Institution :
STATS ChipPAC, Tempe, AZ
Abstract :
A schematic-electromagnetic (EM) hybrid optimization scheme was used to design an integrated passive device (IPD)-diplexer. The method uses component values derived from circuit simulation and optimization to determine physical design changes. The diplexer was fabricated in a silicon wafer process. The small form-factor (2.6 times 1.3 times 0.25 mm3) of this device makes it very attractive for system in package (SiP) applications. Simulated and measured results show good agreement
Keywords :
circuit optimisation; monolithic integrated circuits; radiofrequency integrated circuits; system-in-package; RF silicon integrated passive device; full-circuit design optimization; integrated passive device diplexer; schematic-electromagnetic hybrid optimization scheme; silicon wafer process; system in package; Circuit optimization; Circuit simulation; Circuit synthesis; Coupling circuits; Design optimization; Electronics packaging; Filters; Radio frequency; Semiconductor device packaging; Silicon;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321244
