The Use of Fast Integral Equations Solvers for Practical Package and Interconnect Analysis

Author

Morsey, J.D. ; Rubin, B.J. ; Jiang, L. ; Shan, L. ; Eisenberg, L.B. ; Becker, D. ; Arseneault, M.

Author_Institution

IBM T.J. Watson Res. Center, Yorktown Heights, NY

fYear

2006

Firstpage

335

Lastpage

338

Abstract

Fast integral equation methods are now being applied to packaging and other such "low frequency" problems. This paper explores some of the issues surrounding such an application to real, product level packaging and interconnects type structures. Discussed are issues such as low frequency breakdown, mesh aspect ratios, and solver convergence. Finally, integral equation solver examples are presented using the IBM internally developed pre-corrected FFT (PFFT) solver labeled EMSurf

Keywords

integral equations; integrated circuit interconnections; integrated circuit packaging; electromagnetic modeling tools; fast integral equations solver; full-wave electromagnetic field solver; interconnects type structures; iterative solution; low frequency breakdown; mesh aspect ratio; product level packaging; solver convergence; Electric breakdown; Electromagnetic fields; Electromagnetic modeling; Electromagnetic scattering; Electronics packaging; Frequency estimation; Integral equations; Moment methods; Performance analysis; Testing; Full-wave electromagnetic field solver; electromagnetic modeling tools; fast solvers; iterative solutions;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2006 IEEE

Conference_Location

Scottsdale, AZ

Print_ISBN

1-4244-0668-4

Type

conf

DOI

10.1109/EPEP.2006.321246

Filename

4115424