DocumentCode
1691311
Title
Coupled Modeling of Current Spreading, Thermal Effects, and Light Extraction in Ill-Nitride Light-Emitting Diodes
Author
Bogdanov, M.V. ; Bulashevich, K.A. ; Evstratov, I.Yu. ; Karpov, S.Yu.
Author_Institution
STR, Inc., Richmond
fYear
2007
Firstpage
23
Lastpage
24
Abstract
We study by simulation the current spreading, heat transfer, and light emission in a high-power light-emitting diode (LED) with an interdigitated multipixel array (IMPA) chip design. The applied hybrid approach allows coupled modeling of various processes involved in the LED operation, providing good agreement with observations.
Keywords
heat transfer; light emitting diodes; semiconductor device models; III-nitride light-emitting diodes; IMPA chip design; coupled modeling; current spreading; heat transfer; high-power LED; interdigitated multipixel array; light emission; light extraction; thermal effects; Chip scale packaging; Current density; Electrodes; Heat transfer; Light emitting diodes; Optical coupling; P-n junctions; Proximity effect; Silicon carbide; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Numerical Simulation of Optoelectronic Devices, 2007. NUSOD '07. International Conference on
Conference_Location
Newark, DE
Print_ISBN
978-1-4244-1431-4
Type
conf
DOI
10.1109/NUSOD.2007.4349005
Filename
4349005
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