• DocumentCode
    1691311
  • Title

    Coupled Modeling of Current Spreading, Thermal Effects, and Light Extraction in Ill-Nitride Light-Emitting Diodes

  • Author

    Bogdanov, M.V. ; Bulashevich, K.A. ; Evstratov, I.Yu. ; Karpov, S.Yu.

  • Author_Institution
    STR, Inc., Richmond
  • fYear
    2007
  • Firstpage
    23
  • Lastpage
    24
  • Abstract
    We study by simulation the current spreading, heat transfer, and light emission in a high-power light-emitting diode (LED) with an interdigitated multipixel array (IMPA) chip design. The applied hybrid approach allows coupled modeling of various processes involved in the LED operation, providing good agreement with observations.
  • Keywords
    heat transfer; light emitting diodes; semiconductor device models; III-nitride light-emitting diodes; IMPA chip design; coupled modeling; current spreading; heat transfer; high-power LED; interdigitated multipixel array; light emission; light extraction; thermal effects; Chip scale packaging; Current density; Electrodes; Heat transfer; Light emitting diodes; Optical coupling; P-n junctions; Proximity effect; Silicon carbide; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Numerical Simulation of Optoelectronic Devices, 2007. NUSOD '07. International Conference on
  • Conference_Location
    Newark, DE
  • Print_ISBN
    978-1-4244-1431-4
  • Type

    conf

  • DOI
    10.1109/NUSOD.2007.4349005
  • Filename
    4349005