Title :
TAB multichip modules: a case study
Author :
Hawley, Adam ; Gayle, Rick
Author_Institution :
NCR Microelectron. Products Div., Colorado Springs, CO, USA
Abstract :
A case history of the design, development, and production of a commercial, high-performance multichip module at NCR Corporation is presented. Included is a brief description of NCR´s strategy followed by design and manufacturing considerations encountered in the development of a tape automated bonded (TAB) module for volume production. These considerations include everything from developing sources for the components, to design for manufacturability requirements
Keywords :
design engineering; hybrid integrated circuits; integrated circuit manufacture; integrated circuit technology; tape automated bonding; MCM; NCR Corporation; NCR´s strategy; TAB multichip modules; case history; case study; design for manufacturability; high-performance multichip module; manufacturing considerations; volume production; Application specific integrated circuits; Assembly; Bonding; Computer aided software engineering; Design engineering; Electronic packaging thermal management; Manufacturing; Multichip modules; Production; Testing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279739
