• DocumentCode
    1691635
  • Title

    Innovative designs enable 300-V TMBS® with ultra-low on-state voltage and fast switching speed

  • Author

    Hsu, Wesley Chih-Wei ; Udrea, Florin ; Lin, Pai-Li ; Lin, Yih-Yin ; Chen, Max

  • Author_Institution
    R&D Dept., Vishay Gen. Semicond. Taiwan, Taipei, Taiwan
  • fYear
    2011
  • Firstpage
    80
  • Lastpage
    83
  • Abstract
    A 300-V TMBS® (Trench MOS Barrier Schottky) rectifier with novel active-cell and termination design is first proposed and demonstrated. The device features a combination of p-transparent anode and Schottky contact, considerably reducing on-state voltage and ensuring a high degree of performance uniformity. A floating p-layer is used in termination region under a trench area to significantly enhance the blocking capability to 95% of the ideal breakdown voltage. In addition, the new termination design is area-efficient, being only 30 to 40 μm in width, which is less than 33% of the conventional guard-ring terminations. Experimental results have shown that the new 300-V TMBS structure with the novel active cell and termination design exhibits ultra-low on-state voltage of less than 0.9 V at 250 A/cm2, a fast turn-off time lower than 55 ns and a high breakdown voltage over 380 V. It is noteworthy that these new components in active and termination regions can be formed without any additional masks, and hence at no extra cost.
  • Keywords
    MIS devices; Schottky barriers; network synthesis; rectifiers; 300-V TMBS rectifier; Schottky contact; active-cell design; breakdown voltage; fast switching speed; p-transparent anode; size 30 mum to 40 mum; termination design; trench MOS barrier schottky; turn-off time; ultra-low on-state voltage; voltage 300 V; Anodes; Current density; Insulated gate bipolar transistors; Leakage current; Rectifiers; Schottky barriers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on
  • Conference_Location
    San Diego, CA
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4244-8425-6
  • Type

    conf

  • DOI
    10.1109/ISPSD.2011.5890795
  • Filename
    5890795