• DocumentCode
    1691684
  • Title

    Re-engineering the STMicroelectronics manufacturing model

  • Author

    Carchiolo, V. ; Ambra, S. D´ ; Longheu, A. ; Malgeri, M.

  • Author_Institution
    Istituto di Inf. e Telecommun., Catania Univ., Italy
  • fYear
    2000
  • fDate
    2/1/2000 12:00:00 AM
  • Firstpage
    231
  • Lastpage
    234
  • Abstract
    Current manufacturing systems have a very structured production model, especially when high precision is required, as in semiconductor device manufacturing. In addition, rapid changes in production and market requirements may occur, hence great flexibility is also essential. These goals often impose the re-engineering of periodically existing models, in order to remove its limitations, also adding new capabilities, significantly reducing the time-to-market of new products. Updating a model generally also requires the improvement of existing applications, both re-writing software components as well as adding new features. We consider the current model used inside STMicroelectronics facilities to define production flow. We first describe the model and its limitations, then we introduce an enhanced, object-oriented model, with inheritance and hierarchy support. We also consider which improvements are required on existing applications in order to support such a model, introducing an enhanced environment
  • Keywords
    computer integrated manufacturing; inheritance; object-oriented programming; software reusability; systems re-engineering; STMicroelectronics manufacturing model; inheritance; manufacturing systems; market requirements; object-oriented model; production model; semiconductor device manufacturing; software components; system re-engineering; time-to-market; Electrical capacitance tomography; Manufacturing systems; Tellurium; Testing; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Software Maintenance and Reengineering, 2000. Proceedings of the Fourth European
  • Conference_Location
    Zurich
  • Print_ISBN
    0-7695-0546-5
  • Type

    conf

  • DOI
    10.1109/CSMR.2000.827332
  • Filename
    827332