DocumentCode :
16917
Title :
Introducing Mutual Heating Effects in the Ladder-Type Soil Model for the Dynamic Thermal Rating of Underground Cables
Author :
Diaz-Aguilo, Marc ; de Leon, Francisco
Author_Institution :
Dept. of Electr. & Comput. Eng., New York Univ., New York, NY, USA
Volume :
30
Issue :
4
fYear :
2015
fDate :
Aug. 2015
Firstpage :
1958
Lastpage :
1964
Abstract :
The proper modeling of the transient thermal behavior of mutual heating effects between underground power cables is very important for the rating of transmission and distribution cables. The IEC standards proposed an accurate model based on exponential integrals that it can be difficult to implement in basic electrical software. The model is not consistent with the layered modeling of the cable thermal resistances. In this paper, a simple and easy-to-use alternative model is presented. It consists of injecting the correct current at the right position of the RC circuit representing the soil. The new model can accurately reproduce the full physics of the transient phenomenon and is consistent with the modeling of the cable used in the IEC standards themselves. The new model is tested and validated against numerous finite-element simulations for realistic cable installations.
Keywords :
IEC standards; finite element analysis; power cables; soil; thermal resistance; underground cables; IEC standard; RC circuit; distribution cable thermal resistance; finite element simulation; ladder-type soil model; mutual heating effects transient thermal behavior; transient phenomenon; transmission cable; underground power cable dynamic thermal rating; Computational modeling; Heating; Integrated circuit modeling; Mathematical model; Power cables; Soil; Transient analysis; Mutual heating; power system measurement; power systems; real-time thermal rating; thermal modeling; underground cables;
fLanguage :
English
Journal_Title :
Power Delivery, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8977
Type :
jour
DOI :
10.1109/TPWRD.2015.2390072
Filename :
7008559
Link To Document :
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