Title :
What does the customer expect from a perfectly designed and manufactured PQFP package?
Author :
Shinohara, Alex Akira
Author_Institution :
Matsushita Electron. Corp. of America, Puyallup, WA, USA
Abstract :
It is pointed out that customers of semiconductor packaged devices have strongly requested new, advanced SMDs which meet their requirements. Semiconductor manufacturers have made great efforts to develop and manufacture new semiconductor packages. They have endeavored to satisfy even unreasonable demands. The main reasons for the ability of Japanese semiconductor manufacturers to continue as they do now are described. In addition, mismatches of PQFP (plastic quad flat pack) package design between the Electronics Industry Association in Japan and the Joint Electronics Devices Engineering Council are considered. It is noted that the current situation cannot be considered desirable from a standardization point of view
Keywords :
packaging; standardisation; surface mount technology; EIAJ; Electronics Industry Association in Japan; JEDEC; Japanese semiconductor manufacturers; Joint Electronics Devices Engineering Council; PQFP; SMDs; customer expectation; fine-pitch packages; package design mismatches; plastic QFP; plastic quad flat pack; semiconductor packages; standardization; surface mount devices; Costs; Electronics packaging; Investments; Manufacturing; Meetings; Packaging machines; Pins; Semiconductor device manufacture; Semiconductor device packaging; Standardization;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279748