Title :
The latest molding technology for fine pitch P-QFP
Author_Institution :
Toshiba Corp., Kawasaki, Japan
Abstract :
The author describes the molding technology for fine pitch P-QFP. Problems associated with the packaging technology for fine pitch P-QFP are discussed with reference to the best directions for package structure concerning larger package, larger IC chips, thinner package, and fine lead pitch package; molding methods; and the questions of what kind of a molding compound can satisfy the above mentioned molding demands and what are the material´s physical and chemical properties and characteristics? The package structure, a new molding method, and a new molding compound are described
Keywords :
VLSI; encapsulation; packaging; fine lead pitch package; fine pitch P-QFP; fine pitch PQFP; larger IC chips; larger package; molding compound; molding methods; molding technology; package structure; thinner package; Filling; Integrated circuit packaging; Integrated circuit testing; Lead; Microelectronics; Plastic packaging; Resins; Semiconductor device packaging; Soldering; Surface-mount technology;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279752
