DocumentCode :
1692039
Title :
High-temperature characterization of a PD SOI CMOS process with LDMOS and lateral bipolar structures
Author :
Adriaensen, S. ; Dessard, V. ; Delatte, P. ; Querol, I. Rovira ; Flandre, Denis ; Richter, S.
Author_Institution :
Microelectron. Lab., Univ. Catholique de Louvain, Belgium
fYear :
1999
fDate :
6/21/1905 12:00:00 AM
Firstpage :
79
Lastpage :
82
Abstract :
High-temperature characterization of a 0.8 μm partially-depleted (PD) silicon-on-insulator (SOI) CMOS process is reported. The process is designed for mixed analog/digital/high-voltage applications. The measurements have been realized on n-MOSFETs, on lateral bipolar transistors and on LDMOS transistors and demonstrate the interest of the process under consideration
Keywords :
CMOS integrated circuits; bipolar transistors; high-temperature electronics; leakage currents; power MOSFET; semiconductor device breakdown; semiconductor device measurement; silicon-on-insulator; 0.8 mum; 20 to 300 C; LDMOS transistors; breakdown voltage; high-temperature characterization; lateral bipolar transistors; leakage current; mixed analog/digital/high-voltage applications; n-MOSFETs; on-resistance; partially depleted SOI CMOS process; Bipolar transistors; CMOS process; CMOS technology; Fabrication; Laboratories; MOSFET circuits; Microelectronics; Space technology; Temperature; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Temperature Electronics, 1999. HITEN 99. The Third European Conference on
Conference_Location :
Berlin
Print_ISBN :
0-7803-5795-7
Type :
conf
DOI :
10.1109/HITEN.1999.827467
Filename :
827467
Link To Document :
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