DocumentCode :
1692181
Title :
New mode crack of LSI package in the solder reflow process
Author :
Adachi, M. ; Ohuchi, S. ; Totsuka, N.
Author_Institution :
OKI Electric Ind. Co. Ltd., Tokyo, Japan
fYear :
1991
Firstpage :
171
Lastpage :
174
Abstract :
A new mode crack that could not be explained by a general mechanism has been observed under the condition of the surface mount components being smaller and thinner, and requiring more severe characteristics in the solder reflow process. The mode crack is generated from the upper portion of the die pad corner, and is not caused by the delamination between the die pad and the plastic. This new mode crack mechanism is explained in the following way. Absorbed moisture reaches the die attachment layer during storage and is vaporized by heat in soldering; the vapor pressure pushes down the die pad and causes stress in the plastic of the upper portion of the die pad corner; then new mode cracks are generated. The authors also describe how a new lead frame design can prevent this crack
Keywords :
cracks; integrated circuit technology; large scale integration; soldering; surface mount technology; LSI package; absorbed moisture; crack mechanism; die pad; lead frame design; mode crack; solder reflow process; stress; surface mount components; vapor pressure; Delamination; Large scale integration; Moisture; Plastic packaging; Plastics industry; Sliding mode control; Soldering; Surface cracks; Temperature; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
Type :
conf
DOI :
10.1109/IEMT.1991.279771
Filename :
279771
Link To Document :
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