Thermal management and thermomechanical optimization at higher temperatures

Summary form only given. For thermal management one has to distinguish between two categories: the heating of electronic components by their environment and heating due to power dissipation in the electronics. In the first case thermal insulation is essential for component protection. The authors show the limits of cooling mechanisms using liquids (liquid coolers and heat pipes) as well as electrothermal cooling. Furthermore, possibilities of passive cooling (heat spreading) are discussed. From the viewpoint of thermomechanical aspects, high temperature applications are complicated, because large temperature intervals drastically increase thermal mismatch in comparison to normal conditions. Effective cooling and equalizing temperature distributions are suitable to lower thermal mismatch by avoiding excessive temperature gradients. Thermomechanical principles like CTE matching or applying ductile intermediate layers, well known from low temperature packaging, become extremely more important. Some aspects of mechanical stresses on the acceleration of diffusion processes are discussed