Packaging alternatives for high lead count, fine pitch, surface mount technology

Author

Chroneos, R. ; Mallik, D. ; Prough, S.

Author_Institution

Intel Corp., Chandler, AZ, USA

fYear

1991

Firstpage

181

Lastpage

186

Abstract

It is noted that fine pitch SMT (surface mount technology) components potentially offer substantial benefits for cost, performance, and miniaturization in assembly of high integration, high lead count ICs in portable electronic systems. However, several issues involving component handling, solder process, rework, and reliability concerns must first be overcome. It is noted that a variety of packaging alternatives exist today for surface mount high leadcount components. Any choice must address these surface mount issues as well as the requirements of next-generation highly integrated, high-performance IC devices. Details of various packaging alternatives are discussed

Keywords

circuit reliability; integrated circuit technology; soldering; surface mount technology; component handling; fine pitch; high lead count; high-performance IC devices; packaging alternatives; portable electronic systems; reliability; rework; solder process; surface mount technology; Assembly; Computer aided manufacturing; Costs; Electronics packaging; High performance computing; Integrated circuit packaging; Microcomputers; Microprocessors; Plastic packaging; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-0155-2

Type

conf

DOI

10.1109/IEMT.1991.279773

Filename

279773