Relationships between radiation tolerant and high temperature electronics

Author

Sharp, R.E. ; Pater, S.L. ; Cook, J. ; Peat, R.

Author_Institution

AEA Technol., Abingdon, UK

fYear

1999

fDate

6/21/1905 12:00:00 AM

Firstpage

169

Abstract

Summary form only given. Five aspects of technology have to be addressed by the designer on order that his system operates successfully in a hostile environment: basic effects on operating parameters of semiconductor components; basic effects on operating parameters of passive components; mechanical effects on packaging, substrates, and adhesives; electrochemical effects on semiconductor junctions and solders; and system effects, including heat dissipation, off-gassing and chemical by-products. Each of these aspects is examined to identify the commonalities between high temperature and radiation tolerant applications, highlighting the areas where one community can learn and benefit from the other

Keywords

high-temperature electronics; integrated circuit design; integrated circuit packaging; integrated circuit reliability; radiation hardening (electronics); IC design; adhesives; chemical by-products; electrochemical effects; heat dissipation; high temperature electronics; hostile environment; mechanical effects; off-gassing; operating parameters; packaging; passive components; radiation tolerant electronics; semiconductor components; semiconductor junctions; solders; substrates; system effects; Consumer electronics; Control systems; Defense industry; Electrical equipment industry; Ionizing radiation; Nuclear electronics; Petroleum; Production systems; Space technology; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

High Temperature Electronics, 1999. HITEN 99. The Third European Conference on

Conference_Location

Berlin

Print_ISBN

0-7803-5795-7

Type

conf

DOI

10.1109/HITEN.1999.827485

Filename

827485