• DocumentCode
    1692398
  • Title

    TARGET: thermal accelerated reliability go-no-go environmental testing dynamic board thermal shock using a single liquid fluorocarbon bath

  • Author

    Beaton, Bradford P.

  • Author_Institution
    NCR Corp., West Columbia, SC, USA
  • fYear
    1991
  • Firstpage
    212
  • Lastpage
    214
  • Abstract
    TARGET, a novel method of accelerated thermal stress for board testing, is described. This method utilizes Fluorinert as the medium for rapid thermal energy transfer. Possible applications include environments for STRIFE testing and board debug. One of the most promising applications is in-line environmental stress screening (ESS). Boards receive a thorough temperature stress screen in the time taken for conventional go-no-go tests. The process is described in detail and analyzed. Data from initial experiments are presented
  • Keywords
    circuit reliability; environmental testing; life testing; printed circuit testing; thermal shock; Fluorinert; STRIFE testing; TARGET; accelerated thermal stress; board debug; dynamic board thermal shock; in-line environmental stress screening; reliability go-no-go environmental testing; single liquid fluorocarbon bath; Costs; Electric shock; Energy exchange; Fixtures; Life estimation; Refrigerants; Technological innovation; Temperature; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-0155-2
  • Type

    conf

  • DOI
    10.1109/IEMT.1991.279779
  • Filename
    279779