Title :
Frequency domain behavior of solid and gridded reference power/ground planes in LTCC modules
fDate :
6/24/1905 12:00:00 AM
Abstract :
This paper presents simulation and experimental results for gridded power/ground plane structures in LTCC-modules. The approach of using different simulation techniques for power/ground structures is discussed and a wire-trace model for solid-gridded plane pair based on the transmission line model is derived and verified with measurements.
Keywords :
ceramic packaging; circuit simulation; frequency-domain analysis; modules; power supply circuits; transmission line theory; LTCC-modules; frequency domain behavior; gridded power/ground plane structures; gridded reference power/ground planes; power/ground structures; simulation; simulation techniques; solid reference power/ground planes; solid-gridded plane pair; transmission line model; wire-trace model; Analytical models; Fabrication; Frequency domain analysis; Geometry; Impedance; Power transmission lines; Printed circuits; Resonant frequency; Solid modeling; Voltage;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008072
